Advanced FIB-SEM for Automated Sample Preparation, Nanoscale Characterization and Nanoprototyping
Unlock the power of Tescan AMBER™ 2
Nanocharacterization Across Broad Variety of Samples
The field-free UHR-SEM column ensures charge-free imaging and analysis optimized for different sample types, including non-conductive, ferromagnetic, or semiconductor devices.
Fully Automated TEM Specimen Preparation, even for inverted and planar TEM specimens
The integrated TEM AutoPrep Pro™ module enables unattended, multi-site batch TEM sample preparation on multiple samples and at different locations, supporting continuous processing even overnight. With the OptiLift™ nanomanipulator, users can prepare inverted or planar TEM samples and transfer them from material to grid in the required feature orientation, making it easier to characterize challenging materials.
Fully Integrated Argon Beam Cleaning in the FIB-SEM chamber
Achieve ultra-thin specimen ( below 20 nm) with pristine quality from any materials with a controlled final polishing step down to 200 eV using the integrated Argon Aura Gentle Ion Beam™ polisher within the FIB-SEM chamber.
Optimized Workflows for Multi-User Lab
The latest generation of the Tescan AMBER™ platform is designed to deliver peak levels of automation into everyday workflows. Tescan Essence™ supports multi-user environments with guided or automated workflows, automatic SEM and FIB alignments, and smart tools such as 3D virtual collision protection and compucentric stage movements, enabling even non-expert users to operate the FIB-SEM with confidence.
Extending Scientific Insights from Multimodal Data in 2D and 3D
AMBER™ ’s multimodal detection system captures multiple imaging signals at once or pairs them with analytical techniques such as EDS, EBSD, ToF-SIMS, cathodoluminescence, or Raman spectroscopy. Extend the row of modalities into 3D utilizing a fully integrated FIB-SEM Tomography featuring automated, acquisition from optimum acquisition angles.
Fabricate, Create or Modify Materials into Functional Devices
Tescan AMBER™ FIB-SEM provides the foundation for electron beam lithography, ion beam patterning, and FEBID or FIBID applications, supporting versatile and precise device-design prototyping. Additionaly, experiment with your own SEM and FIB patterning strategies by taking direct control of the patterning engine through the scripting interface.
TESCAN TEM AutoPrep Pro™
Tescan AMBER™ 2 works seamlessly with Tescan TEM AutoPrep Pro™ to enable fully automated, reproducible TEM lamella preparation. The system manages site selection, trenching, thinning, and polishing with minimal operator input. It produces consistently thin samples while maximizing instrument time efficiency.
TEM AutoPrep Pro™ combines precision automation with real-time imaging through Tescan Essence™ software, ensuring accuracy and repeatability. Together with AMBER™ 2’s BrightBeam™ SEM and Orage™ FIB technologies, this workflow reduces beam exposure, shortens preparation time, and preserves sample integrity for reliable daily operation.
