Tescan AMBER X™ 2 is an advanced plasma FIB-SEM that combines the Mistral™ Plasma FIB column with the field-free BrightBeam™ UHR SEM to deliver high speed, precision, and versatility in sample preparation and characterization.
Designed for advanced materials science research, it enables Ga⁺-free, low-damage, fully automated TEM lamella preparation with TEM AutoPrep Pro™, while supporting high-throughput 2D and 3D multimodal analysis.
- A unified platform for both precision TEM prep and large-volume 3D characterization
- Ga+-free TEM lamella preparation with minimal amorphization damage
- Fully automated (TEM AutoPrep Pro™) workflow for consistent and accessible sample preparation
- High-throughput 3D analysis with stable beam performance at all FIB and SEM currents
- Field-free BrightBeam™ UHR SEM for magnetic, non-conductive, and sensitive materials
- Energy-filtered electron signals for enhanced surface and phase contrast of the samples
Where Tescan AMBER X™ 2 makes the difference
High-Precision, Large-Area Cross Sections
Generate high-quality cross sections at high milling currents with Mistral™ Plasma FIB, combining rapid material removal with nanometer-scale accuracy for both large-volume and fine-detail workflows.
Ultra-High-Resolution Nanocharacterization
Image and analyze the widest range of materials with the BrightBeam™ field-free UHR SEM, delivering stable low-energy performance ideal for magnetic, non-conductive, and beam-sensitive samples.
Ga+-Free TEM Sample Preparation
Prepare clean, damage-reduced TEM lamellae using Xe+ plasma FIB—achieving the precision of Ga+ workflows without the risk of gallium contamination.
Fast, Artifact-Reduced Large-Volume 3D Analysis
Accelerate large-area cross-sectioning and 3D tomography up to 1 mm while maintaining superior surface quality. The TESCAN Rocking Stage minimizes curtaining, even in porous, brittle, or highly heterogeneous materials.
Multimodal 3D Chemical and Structural Insight
Acquire EDS, EBSD, and ToF-SIMS data within a single FIB-SEM tomography workflow to reveal morphology, crystallography, elemental composition, and isotopic chemistry in true 3D.
Automated TEM Workflow Acceleration
Leverage TEM AutoPrep Pro™ for guided or fully automated lamella preparation. Region selection, geometry setup, and final polishing are streamlined, increasing reproducibility and freeing instrument time for imaging and analysis.
Scalable, User-Friendly Operation for Any Lab
Operate confidently with guided automation, intuitive controls, and modular Tescan Essence™ software—supporting both expert and novice users in high-throughput, multi-user environments.
Tescan AMBER X™ 2
Technical specification
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Electron Optics
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Electron Beam Column
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BrightBeam™ Field-Free UHR-SEM Column
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Electron Beam Resolution
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Magnification
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6x to 2,000,000x
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Electron Source
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Schottky field electron emitter
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Electron Beam Landing Energy Range
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50 eV – 30 keV (< 50 eV with BDM)
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Probe Current
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2 pA – 400 nA (continuosly adjustable)
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Ion Optics
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Ion Beam Column
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Mistral™ Plasma Focused Ion Beam Column
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Ion Beam Resolution
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10 nm @ 30 keV
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Maximum Field of View
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1 mm @ 30 keV
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Probe Current
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1 pA – 3.3 uA
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Ion Beam Energy Range
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500 eV – 30 keV
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Detectors
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Standard Detectors
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Optional Detectors
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Analyzers
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Stage & Sample
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Stage
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Motorized, 5-axis compucentric stage
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X & Y axis travel range
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130 mm
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Z axis travel range
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96 mm
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Rotation
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Compucentric, 360° (continuous)
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Tilt range
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Compucentric, -70° to +90°
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Max. specimen height
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92 mm (133 mm without stage rotation)
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Max. specimen size
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180 mm diameter with full XY moves, rotation, no tilt (larger samples possible with limited stage travel and rotation)
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Maximum specimen weight
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Tescan Amber X™ 2 Applications
- Tescan AMBER X™ 2 in Materials Science
- Tescan AMBER X™ 2 in Semiconductors
- Tescan AMBER X™ 2 in Batteries
- Tescan AMBER X™ 2 in Life Science (Large-volume processing, deep ROI access, and multimodal analysis of biological samples)
