Where Tescan Solaris™ 2makes the difference
Automation Without Variability
Eliminate operator-dependent results with AI-driven TEM AutoPrep™ Pro automation. Every lamella is prepared with the same precision, from protection layer deposition to low keV polishing.
Reproducible Quality Across All Geometries
Whether top-down, inverted, or plan-view, SOLARIS™ 2 ensures consistent results through optimized single-step, in situlift-out workflows.
Higher Throughput, Less Downtime
Automated electron and ion column alignments keep the system ready at all times—reducing setup time and enabling continuous, unattended operation.
Minimal Beam Damage, Maximum Precision
The Orage™ 2 Ga FIB column and Triglav™ SEM optics deliver high-resolution milling and end-pointing with minimal amorphization or surface alteration.
Customizable Workflows for Every Device
Easily adapt processes for logic, memory, power, or display technologies. Switch between semi-automated and fully automated modes as your workflow demands.
Always Ready for Next-Shift Performance
With self-checking routines and overnight alignment, SOLARIS™ 2 maintains stable performance and reproducible precision—day after day.
Tescan SOLARIS™ 2 integrates seamlessly with Tescan TEM AutoPrep™ Pro, delivering a fully automated workflow for TEM lamella preparation inside the FIB-SEM. From trench milling to final polishing, every step is automated to ensure consistent, repeatable results with minimal operator input.
AI-driven pattern recognition and automated beam alignment streamline targeting and setup, while overnight calibration keeps the system ready for continuous operation. Integrated OptiLift™ nanomanipulator control supports top-down, inverted, and plan-viewgeometries without manual repositioning.
Combined with the Triglav™ SEM column’s high-contrast imaging for precise end-point detection, SOLARIS™ 2 with TEM AutoPrep™ Pro delivers reproducible, high-quality TEM samples for logic, memory, and advanced 3D device analysis.
