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Tescan SOLARIS X™ 2

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Product Details

Tescan SOLARIS X^™ 2 is built for laboratories where package-level failure analysis, large-area cross-sectioning, and Ga-free sample preparation demand both speed and precision. Powered by the Mistral™ Xe Plasma FIB column, SOLARIS X^™ 2 delivers high-current milling with exceptional surface quality, while the Triglav™ SEM column ensures nanometer-scale imaging accuracy at the beam coincidence point. The result: fast, artifact-free cross-sections and reliable results across advanced IC packages, MEMS, and display devices.

High-throughput Plasma FIB-SEM for efficient large-area and deep cross-sectioning

Nanometer-precision end-pointing with Triglav™ SEM imaging at the FIB-SEM coincidence point

Artifact-free cross-sections using Rocking Stage and TRUE X-sectioning technology

Ga-free TEM lamella preparation with inert Xe ions for damage-free analysis

Where Tescan Solaris X™ 2 makes the difference

Throughput at Every Scale

Achieve fast, large-area cross-sectioning with Xe Plasma FIB currents up to 3.3 µA—ideal for analyzing complex IC packages and stacked devices.

Precision End-Pointing

Locate and expose sub-surface defects with nanometer accuracy at the FIB–SEM coincidence point using the Triglav™ SEM column.

Artifact-Free Cross-Sections

Eliminate curtaining and terrace effects with TRUE X-sectioning and Rocking Stage technology for clean, reproducible results across materials.

Ga-Free Sample Preparation

Protect sensitive device layers and interfaces with inert Xe ion milling, enabling pristine TEM lamellae ready for STEM or EDS analysis.

Workflow Automation

Reduce setup time and user variability through automated column alignment and guided operations in the Essence™ user interface.

Scalable Efficiency

Handle everything from large volume millingto fine defect isolation within a single system—extending Plasma FIB-SEM performance to both large- and small-scale applications.

Tescan TEM AutoPrep™ Pro

AUTOMATION THAT INCREASES OUTPUT

TEM AutoPrep^™ Pro is integrated into the Tescan SOLARIS X^™ 2 platform, automating TEM lamella preparation from trenching to final thinning with minimal manual input. Paired with Tescan EXLO^™, preparation and extraction run in parallel to maximize beam utilization, reduce turnaround time, and deliver consistent, high-quality results.

Operators benefit from guided automation, motorized precision, and real-time imaging within the Essence™ user interface. Automated alignment and intuitive controls reduce setup time and user variability, making SOLARIS X^™ 2 and Tescan TEM AutoPrep™ Pro a scalable, high-throughput solution for reproducible TEM sample preparation.

TEM AutoPrepTM GUI for fully automated TEM lamella preparation-1

Tescan SOLARIS X™ 2 APPLICATIONS

Tescan SOLARIS X™ 2 in Materials Science

Precise plasma FIB fabrication combined with large-volume 3D analysis for advanced materials research

Tescan SOLARIS X™ 2 in Semiconductors

High-precision Plasma FIB-SEM for physical failure analysis and process validation

Tescan SOLARIS X™ 2 in Life Science

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